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Ultra Soft Thermal Gap Pad 1.2 W/M-K,2.0 G/Cc For Display Card

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Ultra Soft Thermal Gap Pad 1.2 W/M-K,2.0 G/Cc For Display Card

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Brand Name : ZIITEK

Model Number : TIF140-12-05US

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Heat Capacity : 1 l/g-K

Thermal conductivity : 1.2 W/m-K

Hardness : 20±5 Shore 00

Density : 2.0 g/cc

Continuos Use Temp : -40 to 160℃

Flame rating : 94 V0

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ultra soft UL recognized High durability thermal pad Good thermal conductive for display card,1.2 W/m-K,2.0 g/cc

The TIF140-12-05US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.

TIF100-12-05US-Specification-sheet.pdf


Features

> Good thermal conductive: 1.2 W/mK

>Thickness:1.0mmT

>hardness:20±5 shore00

>Colour: blue

>Available in varies thicknesses

>Broad range of hardnesses available

>Moldability for complex parts


Applications

>mainboard/mother board

>notebook

>power supply

>Heat pipe thermal solutions

>Memory Modules

>Mass storage devices

Typical Properties of TIF140-12-05US Series
Color
blue
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

2.0g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
1.0mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
20±5 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgassing(TML)
0.45%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.5 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
1.2 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.

Request adhesive on double side with "A2" suffix.

Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.

Ultra Soft Thermal Gap Pad 1.2 W/M-K,2.0 G/Cc For Display Card

FAQ

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A:1. Click the "Sent messages" button to continue with the process.

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This message should include any questions you might have about the products as well as your purchase requests.

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4. We will reply you as soon as possible with Email or online


Product Tags:

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