Home > Thermal Conductive Pad >

Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules

Product Categories

Phase Changing Materials [41]
Thermal Conductive Pad [173]
Thermal Gap Filler [206]
Thermal Conductive Grease [27]
Thermal Insulation Materials [49]
Thermal Graphite Sheet [57]
Thermal Adhesive Tape [47]
Thermal Conductive Glue [15]
Thermal Conductive Adhesive [13]
Thermal Conductive Plastic [23]
Sponge Foam Material [13]
PET Double Sided Tape [11]
Thermal Gap Pad [406]
Thermal Conductive Gel [23]
Silicone Foam Gasket [11]
Silicone Free Gap Filler Pad [13]
Shielding Absorbing Materials [19]
Thermal Conductivity Sharp Metal [2]

Dongguan Ziitek Electronic Materials & Technology Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules

Name: Cpu Thermal Pad 40WMK With 45 Shore 00 Hardness For RDRAM Memory Modules
Brand: ZIITEK
Price: 1 USD

Quality Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules for sale

Brand Name : ZIITEK

Model Number : TIF100-40-11S

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 days

Packaging Details : 1000pcs/bag

Products name : Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules

Thermal conductivity : 4.0W/m-K

Hardness : 45±5 Shore 00

Operating Temp : -40-160℃

Keywords : Cpu Thermal Pad

Specific Gravity : 3.28 g/cc

Dielectric Constant（@ 1MHz） : 4.75

Flame Rating : 94-V0

Sample : Sample free

Application : Gpu RDRAM Memory Modules

Contact Now

Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules

The TIF100-40-11S Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features:

> Good thermal conductive: 4.0W/mK

> Outstanding thermal performance

> Broad range of hardnesses available
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

Applications:

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> CPU
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

Typical Properties of TIF^®100-40-11S Series
Color	Gray	Visual
Construction	Ceramic filled silicone elastomer	******
Thickness Range(inch/mm)	0.020~0.20inch(0.5mm~5.0mm)	ASTM D374
Density(g/cc)	3.28 g/cc	ASTM D792
Hardness	45±5 Shore 00	ASTM 2240
Recommended Operating Temperature(℃)	-40 to 160℃	******
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149
Dielectric Constant @ 1MHz	4.75	ASTM D150
Volume Resistivity	≥1.0X10¹² Ohm-meter	ASTM D257
Flame rating	94-V-0	UL94(E331100)
Thermal conductivity	4.0 W/m-K	ASTM D5470

Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules

Company profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Our services

Online-service : 12 hours , Inquiry reply within fastest.

Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Product Tags:

Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules Images

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Dongguan Ziitek Electronic Materials & Technology Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!

Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules

Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules

thermal conductive material

cpu thermal pad

Cpu thermal conductive adhesive pads

Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules Images